X-Meritan is a experienced China quality Peltier Assembly supplier. Designed as a super-quiet cooling solution with no moving parts, our thermoelectric systems provide high-efficiency thermal management for optical communication modules and medical testing equipment. By manufacturing these assemblies in our own China facility, X-Meritan ensures a stable temperature environment for precision instruments, effectively replacing traditional compressor systems with a more reliable, noise-free alternative.
The Peltier Assembly from X-Meritan is a high-performance cooling module engineered to meet the strict temperature control requirements of modern photonics and medical diagnostics. This Peltier Assembly utilizes advanced semiconductor technology to provide solid-state cooling and heating without the maintenance needs of mechanical refrigeration. As a specialized manufacturer, X-Meritan provides integrated modules with heat sink assembly options, delivering a compact and durable thermal solution that fits seamlessly into portable refrigerators, automotive radar, and high-tech laboratory systems.
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Product Name |
cooler module with heat sink assembly |
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Max Temperature Difference (ΔT) |
≥ 67°C to 72°C (In Vacuum Environment) |
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Max Cooling Capacity |
Full range covering from a few Watts to several hundred Watts |
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Max Operating Voltage |
Standard: 3.9V, 15.4V, 24V, 31.1V (Customizable) |
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Max Operating Current |
Range covering from 1A to 20A+ |
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Ceramic Plate Material |
Alumina (Al2O3) / Aluminum Nitride (AlN, High Thermal Conductivity) |
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Dimensions |
15mm x 15mm to 62mm x 62mm (Customizable) |
● Ultra-Compact and Thin Profile
The structural design is optimized for space-constrained devices, allowing the assembly to be easily embedded into optical modules and portable medical instruments where traditional bulky systems cannot fit.
● Rapid Thermal Response
Unlike compressor-based units that require a startup period, this assembly forms a significant temperature difference almost instantly upon power-on, ensuring immediate thermal stabilization.
● Refined Temperature Accuracy
By precisely adjusting the input current, users can achieve granular control over cooling or heating power, meeting the most stringent tolerances of precision electronic equipment.
● Solid-State Reliability
With no moving parts inside, the assembly fundamentally eliminates operating noise and mechanical vibration, significantly reducing the probability of failure and maintenance costs.
- High-Performance Ceramic Substrate: The middle layer uses alumina or aluminum nitride ceramic sheets, providing superior insulation and high thermal conductivity to fix the chips and transfer heat efficiently.
- Advanced Semiconductor Thermocouples: The core consists of P-type and N-type thermocouple pairs connected in series through precision welding, enabling the fundamental Peltier effect for heat transfer.
- Protective Sealant Encapsulation: The entire internal structure is encapsulated with specialized sealant to resist moisture erosion and oxidation, ensuring long-term durability in varied environments.
- Sturdy Electrical Leads: Equipped with durable external leads designed for high-current operation and secure circuit integration within industrial or automotive systems.
Significant Temperature Gradient: The Peltier Assembly can achieve a maximum temperature difference ($\Delta T_{max}$) of 60-70°C, providing powerful localized cooling even in high-ambient room temperature environments.
Stable Long-Term Operation: Rigorous continuous-run testing shows no significant performance degradation over time, guaranteeing the long-term reliable operation of medical and industrial equipment.
Wide Voltage Adaptation: Designed to operate normally even during slight fluctuations in grid voltage, making it highly adaptable to scenarios with unstable power conditions or automotive power systems.
Optimized Energy Efficiency: Delivers prominent heat dissipation and cooling effects at a lower power consumption compared to standard thermoelectric modules of the same class.
1. Ensure contact surfaces are perfectly flat and apply thermal grease evenly. Screws must be tightened symmetrically to prevent pressure imbalances that could crack the ceramic plates.
2. The hot end must be equipped with a heat sink of sufficient specification to prevent heat accumulation; lack of proper dissipation can lead to immediate component burnout.
3. In humid conditions, ensure appropriate waterproof and moisture-proof treatments are applied to the wiring and edges to prevent oxidation.
4. egularly remove dust from the radiator/heat sink to prevent air blockage and maintain high thermal exchange efficiency over the assembly's lifespan.
1. Backed by a research and development force led by 6 PhDs and a production team of over 200 people, we specialize in advanced semiconductor cooling technology.
2. Our Peltier Assembly adhere to the strict quality control standards of the photonic industry, ensuring they are durable, high-performance, and user-friendly.
3. As a trusted China Manufacturer and Supplier, we offer factory-direct pricing, wholesale services, and a comprehensive price list to help you buy with a competitive discount.
4. From optical communication to automotive radar, we provide professional technical support and a reliable supply chain, keeping many high-demand photonic products in stock for immediate sale.
