X-Meritan is a professional China quality Extruded Thermoelectric Materials supplier. The compression-type thermoelectric materials, as the core of the current high-performance thermal management system, have become the preferred base material for ultra-miniature Peltier modules thanks to their breakthrough in the production technology of large-diameter 25-35 mm ingots. Through the high-pressure plastic deformation process, China based X-Meritan ensures that these High Strength Extruded Thermoelectric Ingot possess extremely high mechanical strength and thermal electric uniformity, providing a reliable temperature control foundation for precision optical communication and medical equipment.
Extruded Thermoelectric Materials by X-Meritan have demonstrated unparalleled advantages in modern semiconductor cooling technology. Particularly, the extrusion process based on the Bi2Te3-Sb2Te3 solid solution has completely addressed the shortcomings of traditional melting materials, such as fragility and limited processing. This Bi2Te3-Sb2Te3 Thermoelectric Materials for peltier modules not only possesses thermoelectric properties comparable to those of the zone melting method, but also, due to its excellent texture, enables the manufacturing of ultra-thin chip modules with a thickness of only 0.2 mm, meeting the stringent requirements for high power density heat dissipation in the 5G era.
Extruded Thermoelectric Materials (TEM), especially Bi2Te3-based alloys, is used to manufacture high-performance, fine-grained semiconductors with a textured and dense structure. This method can enhance mechanical strength, reduce thermal conductivity, and improve figure of merit ZT.
- Length: 120 mm, 240 mm
- Diameter: 25 mm, 30 mm, 35 mm
- Electrical conductivity: 870-1430 Ohm-1cm-1
|
Properties |
P |
N |
|
Compressive Strength (MPa) |
54.0 |
66.0 |
|
Shear Strength (MPa) |
16.0 |
21.0 |
|
Young's Module (GPa) |
47.0 |
42.0 |
|
Poisson's Ratio |
0.30 |
0.30 |
|
Temperature |
Along extrusion direction |
Across extrusion direction |
||
|
N |
P |
N |
P |
|
|
-25C |
10.2 |
10.6 |
12.5 |
10.8 |
|
+50C |
13.3 |
14.0 |
16.6 |
18.0 |
|
+150C |
15.5 |
15.8 |
18.3 |
19.9 |
● The Extruded Thermoelectric Materials has exceptionally high mechanical properties, enabling the production of ultra-thin chip modules with a thickness of only 0.2 millimeters.
● The solid structure is stable, with no moving parts during operation, achieving a completely silent and vibration-free working environment.
● The material has a high degree of texture and uniformity, with an electrical conductivity range of 870-1430 Ohm-1cm-1, ensuring consistent performance.
● The response is rapid and the temperature control is precise. Instant switching between heating and cooling can be achieved simply by changing the current direction.
● The thermoelectric performance is outstanding, with a thermoelectric figure of merit of up to 2.9x10-3 C in a 25°C vacuum environment, comparable to or even superior to that of regional melting materials.
● The integrated chip-level design has an extremely small overall size and light weight, meeting the high-density layout requirements of modern electronic devices.
● Environmentally friendly, the product manufacturing fully complies with the RoHS standard, and does not contain harmful chemicals to the environment.
● The physical reliability is extremely high. High-pressure plastic deformation eliminates internal defects, ensuring that the performance does not deteriorate under long-term cold and hot cycles.
1. Micro TEC Manufacturing: Provides high-strength substrates to support the fabrication of extremely thin electrical pairs required in the optical communication field.
2. Multi-stage TEC assembly: Utilizing extremely high consistency, it meets the requirement of highly synchronized performance of each layer of thermoelectric elements for the multi-stage stacked structure.
3. High-power industrial TEC production: With the use of large-diameter ingot specifications, the production efficiency of large-sized heat sinks is enhanced, and the unit cost is reduced.
4. Precision temperature control Peltier module: Based on precise conductivity formula, it produces special cooling components suitable for research-grade temperature control requirements.
5. High-reliability Medical TEC: Supports the manufacturing of high-performance medical refrigeration chips that can withstand tens of thousands of cold and hot cycles.
1. Materials prepared by the traditional Bridgman method often have the problem of the cleavage surfaces being prone to peeling. Our Extruded Thermoelectric Materials enhance the intergranular bonding force through plastic deformation. This means that during the later slicing and thinning processes, the material can withstand extremely high mechanical stress, enabling the production of micro TEC components with a thickness of only 0.2 mm without generating micro cracks.
2. The stability of performance brought by high texture through stress-induced processes during the extrusion process ensures that the electrical and thermal properties of each batch of rods in mass production have extremely small deviations. For Permalloy modules that require multiple series connections, the consistency of the material directly determines the lifespan and temperature control accuracy of the system.
3. The efficiency of optimizing Bi2Te3 - Sb2Te3 thermoelectric materials for Permalloy modules is highly efficient in a vacuum environment of 25 degrees Celsius. This material exhibits excellent cooling coefficient (COP). Its thermoelectric merit value (Z value) is in the first tier of global commercial materials, effectively reducing power consumption of optical modules and lasers during long-term operation.
In China, we look forward to establishing a solid cooperative relationship with you and jointly promoting the realization of technological innovation by leveraging our N-Type Extruded Thermoelectric Materials. Welcome to contact us and visit X-Meritan immediately and work with us to apply efficient thermoelectric conversion technology to practice and create value together.
