X-Meritan is a professional China quality Assemblies with Micro-thermoelectric Coolers supplier. We can not only provide high reliable Assemblies with Micro-thermoelectric Coolers from customers around the world, but also supply value-added service, we use our key advantage technology to mount thermoelectric coolers in any standard or specially designed packages, such as TO-8, TO-39, BTF,BOX and so on, Those are the most popular heads and packages use for thermoelectrically cooled laser diodes, detectors and sensors for optoelectronic applications.
The Assemblies with Micro-thermoelectric Coolers from X-Meritan represent a sophisticated integration of micro-thermal management and precision packaging technology. We use our key advantage technology to mount thermoelectric coolers in standard or specially designed housings, including Thermoelectric Cooling for BTF Laser Packages, TO-8, and TO-39. By seamlessly integrating modules into metal-glass or metal-ceramic packages, X-Meritan provides the critical thermal stability required for high-performance laser diodes, detectors, and sensors used in modern telecommunications and sensing applications.
We specialize in Micro-TEC Integration in TO Packages and other high-integrity enclosures, providing advanced solid-state cooling solutions for optoelectronic components. Our expert team ensures that every unit meets stringent reliability standards, delivering high-performance Custom TEC Assemblies in BOX Packages for Optoelectronics to global industrial and aerospace partners directly from our specialized factory.
Precision TO Mounting: Assemblies with Micro-thermoelectric Coolers are meticulously mounted onto TO headers with various pin configurations to meet the specific requirements of IR and XRF detectors.
High-Power Laser Support: It includes specialized mounting for HHL and BTF packages, which are designed to handle the high thermal loads associated with high-power laser modules.
HTCC & LTCC Technology: It utilizes metal-ceramic packaging technologies for photodetector arrays, providing a robust and thermally efficient environment for complex semiconductor devices.
Joint Development Packaging: It offers a collaborative development process from concept design and material selection to prototyping, ensuring the final assembly complies with all technical specifications.
TO (transistor form) is the most commonly used packaging form for telecommunication, infrared, XRF and other types of detectors. The basic material of the TO-13 type housing is usually Kovar alloy or nickel-gold plated steel. X-Meritan Company produces thermocouple components for TO connectors with different pins. The pins of these connectors can be in the standard (cylindrical) shape, or in flat-ended or spike shapes to simplify wire welding.
As shown in the table, we can provide the TO service. Our installation service is very flexible. We have very reliable TO suppliers who can provide high-quality products. You can also entrust us with the TO service for installation.
|
Header |
Materials |
Pins |
Appllications |
TEC type |
|
TO-8 type |
Kovar |
6, 12 or 16 |
IR, XRF and other types of detectors |
|
|
TO-39 |
Kovar |
6, 8 or other |
IR, XRF and other types of detectors |
Single to two stages |
|
TO-46 |
Kovar |
5 or 6 pins |
VCSELs, miniature sensors |
Singel stages |
|
TO-66 |
Kovar |
6 or 9 pins |
IR, XRF and other types of detectors |
Single to Four stages |
|
TO-37 |
Kovar |
6 or 9 pins |
IR, XRF and other types of detectors |
Single to two stages |
|
TO-13 |
Kovar |
6, 12 or 16 |
IR, XRF and other types of detectors |
Single to two stages |
In addition to the TO type packaging, we can also offer some other more complex large-scale packaging products, such as HHL, BTF, PS-28, TOSA and HTCC<CC, etc. This provides customers with more choices.
The main applications of these packaging include laser modules, high-power laser modules, detectors and sensors. TOSA is more common in the telecommunications field. HTCC and LTCC types of metal ceramic packaging are used for photodetector arrays. X-Meritan has the technology of installing thermoelectric modules in standard packaging to reduce the dark noise of sensor arrays.
|
Header |
Materials |
Pins |
Appllications |
|
HHL |
Kovar, steel, copper-molybdenum |
high power laser modules |
|
|
BTF |
Kovar with a copper-tungsten base |
14 pins |
laser modules |
|
PS-28, |
nickel and gold plated Kovar |
28 pins |
detectors and sensors |
|
TOSA |
Kovar with copper-tungsten |
|
telecommunications |
|
HTCC& LTCC |
metal-ceramic |
|
photodetector arrays. |
● Assemblies with Micro-thermoelectric Coolers
This solution offers precise assembly of micro-modules into high-integrity packages, ensuring optimal thermal contact and long-term stability for sensitive components.
● Extensive Package Compatibility
It supports a wide range of industry-standard headers including TO-8, TO-39, BTF, and BOX packages, making it versatile for diverse optoelectronic applications.
● Advanced Material Integration
It utilizes Kovar, nickel-plated, and gold-plated steel materials to ensure superior material compatibility and high-vacuum integrity in detector enclosures.
● Minimized Dark Noise
It provides active cooling that effectively reduces the dark noise of sensor arrays, significantly improving the signal-to-noise ratio in photodetector applications.
● Flexible Header Configurations
It features customizable header pins, including standard cylindrical, flattened ends, or nail shapes, to simplify wire bonding and integration into customer-specific PCBs.
1. X-Meritan leverages a decade of specialized knowledge in the thermoelectric industry to provide high-reliable Assemblies with Micro-thermoelectric Coolers.
2. It allows for completely bespoke designs according to customer requirements, ensuring that even the most complex thermal management challenges are addressed.
3. It adheres to strict performance and reliability standards, making our products suitable for mission-critical aerospace and industrial electronic application scenarios.
4. It combines Chinese manufacturing efficiency with high-end engineering to deliver the best cost-performance ratio for professional cooling assemblies worldwide.
